P. K. Rao Et Al. , "Process-Machine Interaction (PMI) Modeling and Monitoring of Chemical Mechanical Planarization (CMP) Process Using Wireless Vibration Sensors," IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING , vol.27, no.1, pp.1-15, 2014
Rao, P. K. Et Al. 2014. Process-Machine Interaction (PMI) Modeling and Monitoring of Chemical Mechanical Planarization (CMP) Process Using Wireless Vibration Sensors. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING , vol.27, no.1 , 1-15.
Rao, P. K., BHUSHAN, M. B., BUKKAPATNAM, S. T. S., KONG, Z., BYALAL, S., Beyca, O. F., ... FIELDS, A.(2014). Process-Machine Interaction (PMI) Modeling and Monitoring of Chemical Mechanical Planarization (CMP) Process Using Wireless Vibration Sensors. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING , vol.27, no.1, 1-15.
Rao, Prahalad Et Al. "Process-Machine Interaction (PMI) Modeling and Monitoring of Chemical Mechanical Planarization (CMP) Process Using Wireless Vibration Sensors," IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING , vol.27, no.1, 1-15, 2014
Rao, Prahalad K. Et Al. "Process-Machine Interaction (PMI) Modeling and Monitoring of Chemical Mechanical Planarization (CMP) Process Using Wireless Vibration Sensors." IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING , vol.27, no.1, pp.1-15, 2014
Rao, P. K. Et Al. (2014) . "Process-Machine Interaction (PMI) Modeling and Monitoring of Chemical Mechanical Planarization (CMP) Process Using Wireless Vibration Sensors." IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING , vol.27, no.1, pp.1-15.
@article{article, author={Prahalad K. Rao Et Al. }, title={Process-Machine Interaction (PMI) Modeling and Monitoring of Chemical Mechanical Planarization (CMP) Process Using Wireless Vibration Sensors}, journal={IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING}, year=2014, pages={1-15} }