D. C. Ringham Et Al. , "ASSESSMENT OF THE ENERGY PERFORMANCE OF COGENERATION SYSTEMS FOR POWERING AND COOLING DATA CENTERS," ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems , California, United States Of America, 2013
Ringham, D. C. Et Al. 2013. ASSESSMENT OF THE ENERGY PERFORMANCE OF COGENERATION SYSTEMS FOR POWERING AND COOLING DATA CENTERS. ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems , (California, United States Of America).
Ringham, D. C., Rice, D. J., Granetz, B. S., Erden, H. S., Khalifa, H. E., & SCHMIDT, R. R., (2013). ASSESSMENT OF THE ENERGY PERFORMANCE OF COGENERATION SYSTEMS FOR POWERING AND COOLING DATA CENTERS . ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, California, United States Of America
Ringham, Dale Et Al. "ASSESSMENT OF THE ENERGY PERFORMANCE OF COGENERATION SYSTEMS FOR POWERING AND COOLING DATA CENTERS," ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, California, United States Of America, 2013
Ringham, Dale C. Et Al. "ASSESSMENT OF THE ENERGY PERFORMANCE OF COGENERATION SYSTEMS FOR POWERING AND COOLING DATA CENTERS." ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems , California, United States Of America, 2013
Ringham, D. C. Et Al. (2013) . "ASSESSMENT OF THE ENERGY PERFORMANCE OF COGENERATION SYSTEMS FOR POWERING AND COOLING DATA CENTERS." ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems , California, United States Of America.
@conferencepaper{conferencepaper, author={Dale C. Ringham Et Al. }, title={ASSESSMENT OF THE ENERGY PERFORMANCE OF COGENERATION SYSTEMS FOR POWERING AND COOLING DATA CENTERS}, congress name={ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems}, city={California}, country={United States Of America}, year={2013}}