E. C. BALOĞLU Et Al. , "Adhesive Ceramic Integrated Structure at Cryogenic Temperatures," International Microelectronics Assembly and Packaging Society (IMAPS), 12th International Conference and Exhibition on Device Packaging , 2016
BALOĞLU, E. C. Et Al. 2016. Adhesive Ceramic Integrated Structure at Cryogenic Temperatures. International Microelectronics Assembly and Packaging Society (IMAPS), 12th International Conference and Exhibition on Device Packaging .
BALOĞLU, E. C., OKUTUCU ÖZYURT, H. T., & DURSUNKAYA, Z., (2016). Adhesive Ceramic Integrated Structure at Cryogenic Temperatures . International Microelectronics Assembly and Packaging Society (IMAPS), 12th International Conference and Exhibition on Device Packaging
BALOĞLU, EYUP, Hanife Tuba Okutucu Özyurt, And ZAFER DURSUNKAYA. "Adhesive Ceramic Integrated Structure at Cryogenic Temperatures," International Microelectronics Assembly and Packaging Society (IMAPS), 12th International Conference and Exhibition on Device Packaging, 2016
BALOĞLU, EYUP C. Et Al. "Adhesive Ceramic Integrated Structure at Cryogenic Temperatures." International Microelectronics Assembly and Packaging Society (IMAPS), 12th International Conference and Exhibition on Device Packaging , 2016
BALOĞLU, E. C. OKUTUCU ÖZYURT, H. T. And DURSUNKAYA, Z. (2016) . "Adhesive Ceramic Integrated Structure at Cryogenic Temperatures." International Microelectronics Assembly and Packaging Society (IMAPS), 12th International Conference and Exhibition on Device Packaging .
@conferencepaper{conferencepaper, author={EYUP CAN BALOĞLU Et Al. }, title={Adhesive Ceramic Integrated Structure at Cryogenic Temperatures}, congress name={International Microelectronics Assembly and Packaging Society (IMAPS), 12th International Conference and Exhibition on Device Packaging}, city={}, country={}, year={2016}}