I. O. Wygant Et Al. , "An Integrated Circuit With Transmit Beamforming Flip-Chip Bonded to a 2-D CMUT Array for 3-D Ultrasound Imaging," IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL , vol.56, no.10, pp.2145-2156, 2009
Wygant, I. O. Et Al. 2009. An Integrated Circuit With Transmit Beamforming Flip-Chip Bonded to a 2-D CMUT Array for 3-D Ultrasound Imaging. IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL , vol.56, no.10 , 2145-2156.
Wygant, I. O., Jamal, N. S., Lee, H. J., Nikoozadeh, A., Oralkan, O., Karaman, M., ... Khuri-Yakub, B. T.(2009). An Integrated Circuit With Transmit Beamforming Flip-Chip Bonded to a 2-D CMUT Array for 3-D Ultrasound Imaging. IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL , vol.56, no.10, 2145-2156.
Wygant, Ira Et Al. "An Integrated Circuit With Transmit Beamforming Flip-Chip Bonded to a 2-D CMUT Array for 3-D Ultrasound Imaging," IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL , vol.56, no.10, 2145-2156, 2009
Wygant, Ira O. Et Al. "An Integrated Circuit With Transmit Beamforming Flip-Chip Bonded to a 2-D CMUT Array for 3-D Ultrasound Imaging." IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL , vol.56, no.10, pp.2145-2156, 2009
Wygant, I. O. Et Al. (2009) . "An Integrated Circuit With Transmit Beamforming Flip-Chip Bonded to a 2-D CMUT Array for 3-D Ultrasound Imaging." IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL , vol.56, no.10, pp.2145-2156.
@article{article, author={Ira O. Wygant Et Al. }, title={An Integrated Circuit With Transmit Beamforming Flip-Chip Bonded to a 2-D CMUT Array for 3-D Ultrasound Imaging}, journal={IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL}, year=2009, pages={2145-2156} }