H. Kizil Et Al. , "TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology," JOURNAL OF ELECTRONIC MATERIALS , vol.30, pp.345-348, 2001
Kizil, H. Et Al. 2001. TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology. JOURNAL OF ELECTRONIC MATERIALS , vol.30 , 345-348.
Kizil, H., Kım, G., Steınbruchel, C., & Zhao, B., (2001). TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology. JOURNAL OF ELECTRONIC MATERIALS , vol.30, 345-348.
Kizil, Hüseyin Et Al. "TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology," JOURNAL OF ELECTRONIC MATERIALS , vol.30, 345-348, 2001
Kizil, Hüseyin Et Al. "TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology." JOURNAL OF ELECTRONIC MATERIALS , vol.30, pp.345-348, 2001
Kizil, H. Et Al. (2001) . "TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology." JOURNAL OF ELECTRONIC MATERIALS , vol.30, pp.345-348.
@article{article, author={Hüseyin Kızıl Et Al. }, title={TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology}, journal={JOURNAL OF ELECTRONIC MATERIALS}, year=2001, pages={345-348} }