Sulfation roasting characteristics of copper-bearing materials


Ozer M., Acma E., Atesok G.

ASIA-PACIFIC JOURNAL OF CHEMICAL ENGINEERING, cilt.12, sa.3, ss.365-373, 2017 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 12 Sayı: 3
  • Basım Tarihi: 2017
  • Doi Numarası: 10.1002/apj.2078
  • Dergi Adı: ASIA-PACIFIC JOURNAL OF CHEMICAL ENGINEERING
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.365-373
  • Anahtar Kelimeler: roasting, sulfation, thermal analysis, copper ores, tailings, chalcopyrite, CONCENTRATE OXIDATION PROCESS, IRON SULFIDES, CHALCOPYRITE, KINETICS, PYRITE, MECHANISM, OXYGEN, STEAM
  • İstanbul Teknik Üniversitesi Adresli: Evet

Özet

In this study, the sulfation roasting characteristics of copper-bearing ore and its flotation products as chalcopyrite concentrate and tailings were investigated in detail. For this aim, the roasting-leaching experiments and thermal analyses were conducted on the samples. As a result of the leaching of sulfated products obtained from the roasting experiments, the maximum Cu extractions were achieved as 94.7%, 99.5% and 82.7%, for run of mine, chalcopyrite concentrate and the flotation tailings, at the roasting temperatures of 550, 650 and 525 degrees C, respectively. It was also found that the copper extractions began to decrease owing to decomposition of copper sulfates above these temperatures. It was indicated that the decomposition temperature of copper sulfates differ for each samples. On the other hand, thermal gravimetric and differential thermal analyses were subjected to identify the thermal behaviors of the samples. The results showed that the formation of metal sulfates occurred in a wide temperature range (394-650 degrees C) for chalcopyrite. On the contrary, copper sulfation reactions took place at narrow temperature ranges of 450-560 degrees C and 480-550 degrees C for the run of mine ore and the flotation tailing, respectively. (C) 2017 Curtin University of Technology and John Wiley & Sons, Ltd.