Lamination curing method for silver nanoparticle inkjet printed flexible electronics: design, uncertainty and performance analysis


Türkmen D., Acer Kalafat M.

JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS, cilt.34, sa.28, ss.1949, 2023 (SCI-Expanded) identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 34 Sayı: 28
  • Basım Tarihi: 2023
  • Doi Numarası: 10.1007/s10854-023-11220-0
  • Dergi Adı: JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Aerospace Database, Applied Science & Technology Source, Chemical Abstracts Core, Communication Abstracts, Compendex, Computer & Applied Sciences, INSPEC, MEDLINE, Metadex, Civil Engineering Abstracts
  • Sayfa Sayıları: ss.1949
  • İstanbul Teknik Üniversitesi Adresli: Evet