Light turning mirrors for hybrid integration of SiON-based optical waveguides and photo-detectors


Civitci F. , SENGO G., DRIESSEN A., POLLNAU M., ANNEMA A. J. , HOEKSTRA H. J. W. M.

OPTICS EXPRESS, cilt.21, ss.24375-24384, 2013 (SCI İndekslerine Giren Dergi) identifier identifier

  • Cilt numarası: 21 Konu: 20
  • Basım Tarihi: 2013
  • Doi Numarası: 10.1364/oe.21.024375
  • Dergi Adı: OPTICS EXPRESS
  • Sayfa Sayıları: ss.24375-24384

Özet

For hybrid integration of an optical chip with an electronic chip containing photo-diodes and processing electronics, light must be coupled from the optical to the electronic chip. This paper presents a method to fabricate quasi-total-internal-reflecting mirrors on an optical chip, placed at an angle of 45 degrees with the chip surface, that enable 90 degrees out-of-plane light coupling between flip-chip bonded chips. The fabrication method utilizes a metal-free, parallel process and is fully compatible with conventional fabrication of optical chips. The mirrors are created using anisotropic etching of 45 degrees facets in a Si substrate, followed by fabrication of the optical structures. After removal of the mirror-defining Si structures by isotropic etching, the obtained interfaces between optical structure and air direct the output from optical waveguides to out-of-plane photo-detectors on the electronic chip, which is aimed to be flip-chip mounted on the optical chip. For transverse-electric (transverse-magnetic) polarization simulations predict a functional loss of 7% (15%), while 7% (18%) is measured. (C) 2013 Optical Society of America