Thermal Profiling of a Small Operational Data Center


Türkmen İ., Mercan C. A. , ERDEN H. S.

ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Anaheim, California, United States Of America, 7 - 09 October 2019 identifier

  • Publication Type: Conference Paper / Full Text
  • Doi Number: 10.1115/ipack2019-6309
  • City: Anaheim, California
  • Country: United States Of America