Thermal Profiling of a Small Operational Data Center

Türkmen İ., Mercan C. A., ERDEN H. S.

ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Anaheim, California, United States Of America, 7 - 09 October 2019 identifier

  • Publication Type: Conference Paper / Full Text
  • Doi Number: 10.1115/ipack2019-6309
  • City: Anaheim, California
  • Country: United States Of America
  • Istanbul Technical University Affiliated: Yes