Thermal Profiling of a Small Operational Data Center

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Türkmen İ., Mercan C. A. , ERDEN H. S.

ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Anaheim, California, United States Of America, 7 - 09 October 2019

• Publication Type: Conference Paper / Full Text
• Doi Number: 10.1115/ipack2019-6309
• City: Anaheim, California
• Country: United States Of America