Copper patterned polystyrene panels by reducing of surface bound Cu (II)-sulfonyl hydrazide complex

Bicak N., Karagoz B.

SURFACE & COATINGS TECHNOLOGY, vol.202, no.9, pp.1581-1587, 2008 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 202 Issue: 9
  • Publication Date: 2008
  • Doi Number: 10.1016/j.surfcoat.2007.06.040
  • Journal Name: SURFACE & COATINGS TECHNOLOGY
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.1581-1587
  • Istanbul Technical University Affiliated: Yes

Abstract

A modified electroless metal deposition method has been developed for copper plating of polystyrene (PS) surfaces. The modified procedure avoids the plasma conditioning and surface activation steps in the classical electroless metal plating process.