Copper patterned polystyrene panels by reducing of surface bound Cu (II)-sulfonyl hydrazide complex

Bicak N., Karagoz B.

SURFACE & COATINGS TECHNOLOGY, cilt.202, sa.9, ss.1581-1587, 2008 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 202 Sayı: 9
  • Basım Tarihi: 2008
  • Doi Numarası: 10.1016/j.surfcoat.2007.06.040
  • Dergi Adı: SURFACE & COATINGS TECHNOLOGY
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.1581-1587
  • İstanbul Teknik Üniversitesi Adresli: Evet

Özet

A modified electroless metal deposition method has been developed for copper plating of polystyrene (PS) surfaces. The modified procedure avoids the plasma conditioning and surface activation steps in the classical electroless metal plating process.