Copper patterned polystyrene panels by reducing of surface bound Cu (II)-sulfonyl hydrazide complex


Bicak N., Karagoz B.

SURFACE & COATINGS TECHNOLOGY, vol.202, no.9, pp.1581-1587, 2008 (Journal Indexed in SCI) identifier identifier

  • Publication Type: Article / Article
  • Volume: 202 Issue: 9
  • Publication Date: 2008
  • Doi Number: 10.1016/j.surfcoat.2007.06.040
  • Title of Journal : SURFACE & COATINGS TECHNOLOGY
  • Page Numbers: pp.1581-1587

Abstract

A modified electroless metal deposition method has been developed for copper plating of polystyrene (PS) surfaces. The modified procedure avoids the plasma conditioning and surface activation steps in the classical electroless metal plating process.