Copper patterned polystyrene panels by reducing of surface bound Cu (II)-sulfonyl hydrazide complex


Bicak N., Karagoz B.

SURFACE & COATINGS TECHNOLOGY, cilt.202, sa.9, ss.1581-1587, 2008 (SCI İndekslerine Giren Dergi) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 202 Konu: 9
  • Basım Tarihi: 2008
  • Doi Numarası: 10.1016/j.surfcoat.2007.06.040
  • Dergi Adı: SURFACE & COATINGS TECHNOLOGY
  • Sayfa Sayıları: ss.1581-1587

Özet

A modified electroless metal deposition method has been developed for copper plating of polystyrene (PS) surfaces. The modified procedure avoids the plasma conditioning and surface activation steps in the classical electroless metal plating process.