Adhesive Ceramic Integrated Structure at Cryogenic Temperatures


BALOĞLU E. C., OKUTUCU ÖZYURT H. T., DURSUNKAYA Z.

International Microelectronics Assembly and Packaging Society (IMAPS), 12th International Conference and Exhibition on Device Packaging, 15 - 17 Mart 2016

  • Yayın Türü: Bildiri / Tam Metin Bildiri
  • İstanbul Teknik Üniversitesi Adresli: Hayır