Adhesive Ceramic Integrated Structure at Cryogenic Temperatures

BALOĞLU E. C., OKUTUCU ÖZYURT H. T., DURSUNKAYA Z.

International Microelectronics Assembly and Packaging Society (IMAPS), 12th International Conference and Exhibition on Device Packaging, 15 - 17 March 2016

  • Publication Type: Conference Paper / Full Text
  • Istanbul Technical University Affiliated: No