Thermally conductive h-BN reinforced PEI composites: The role of processing conditions on dispersion states


Bozkurt Y. E., Yıldız A., Turkarslan O., Sasal F. N., Cebeci H.

MATERIALS TODAY COMMUNICATIONS, cilt.29, 2021 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 29
  • Basım Tarihi: 2021
  • Doi Numarası: 10.1016/j.mtcomm.2021.102854
  • Dergi Adı: MATERIALS TODAY COMMUNICATIONS
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Compendex, INSPEC
  • Anahtar Kelimeler: Polyetherimide, Hexagonal boron nitride, Thermal conductivity, Rheological properties, Extrusion, POLYMER COMPOSITES, CARBON NANOTUBES, MECHANICAL-PROPERTIES, ELECTRICAL-PROPERTIES, MELT RHEOLOGY, BORON-NITRIDE, MANAGEMENT, FILLER, NETWORK, NANOCOMPOSITES
  • İstanbul Teknik Üniversitesi Adresli: Evet

Özet

In this study, h-BN, reinforced PEI composites were studied up to 30 wt% through optimizing process conditions of melt-mixing to tune the thermal conductivity at relatively low-filler ratios while possessing a scalable manufacturing process with thermoplastics operating at high temperatures. The effects of processing parameters on the rheological properties and thermal conductivities of resulting h-BN/PEI composites were determined. DSC and TGA analyses showed that h-BN addition did not lead to a significant change in T-g; however, thermal decomposition temperatures of PEI were shifted. At 30 wt% h-BN loading, a high thermal conductivity as 0.82 W/mK was achieved, which is three times that of neat PEI. The significant enhancement in thermal conductivity was attributed to effective dispersion state of h-BN, creating an enhanced phonon transport mechanism confirmed through rheological analysis. This work provides a thermo-economic solution with relatively low-filler loading ratios in a high temperature and high performance operating polymer. These polymer composites were successfully fabricated in a filament form as candidates for lightweight advanced packaging materials by either injection molding or 3D printing.