TRANSIENT THERMAL RESPONSE OF SERVERS THROUGH AIR TEMPERATURE MEASUREMENTS


Erden H. S. , Khalifa H. E. , SCHMIDT R. R.

ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, California, United States Of America, 16 - 18 July 2013 identifier identifier

  • Publication Type: Conference Paper / Full Text
  • Doi Number: 10.1115/ipack2013-73281
  • City: California
  • Country: United States Of America

Abstract

Transient CFD analysis of data centers requires appropriate representations of the transient thermal characteristics of servers. Thermal conductance and thermal capacitance are two determining characteristics for the response of servers under unsteady conditions. Previous studies proposed tests that require detailed temperature and thermal capacitance measurements for each of the server component, requiring access to individual components inside the server. In this paper, we propose a method for obtaining the transient thermal characteristics of a server from server inlet and outlet temperatures under transient operating conditions.