Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU

Clarke R., Jacob P., Erdogan O., Belemijian P., Raman S., Leroy M. R., ...More

IEEE ACCESS, vol.3, pp.43-54, 2015 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 3
  • Publication Date: 2015
  • Doi Number: 10.1109/access.2015.2396474
  • Journal Name: IEEE ACCESS
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.43-54
  • Istanbul Technical University Affiliated: Yes


We have previously evaluated the feasibility of a serial code accelerator core with 3-D DRAM stacked on the core operating at high frequencies. While operating at such high frequencies (> 24 GHz), there are concerns with removing heat from the 3-D stack. We propose the use of thin diamond sheets, which have high thermal conductivity, as a heat spreader by bonding it close to the processor core substrate and memory stacks. We show, through thermal modeling using COMSOL finite-element analysis tools, the feasibility of diamond as an effective heat spreader in a processor-memory 3-D stack.